Areas of application:
- Product suitable for many types of thick joint bonding of composite parts.
- The product meets requirements for the operations of gap filling, surface filling and sealing.
- The product can be used as a laminating aid.
Properties / advantages:
- Semi flexible bonding paste for dynamic bonding applications.
- Bonding paste with fibres for thick joints.
- Very smooth consistency, and easy to apply with a spatula or comb applicator.
- Due to its non shrinkage characteristics, dimensional stability of part is maintained during the curing cycle of the paste.
- Not suitable for use in thick bond applications.
Surface to be bonded should be free from dust and contaminants which can adversely affect the bond adhesion strength. Preparation of surface is recommended using light abrasion / sanding followed by cleaning with appropriate solvent.
The bonding paste is ready to use and reaction is initiated using 1% to 2% of MEK peroxide under normal workshop application conditions (15-25°C).
Apply a uniform bead of bonding paste onto one of the surfaces and press parts together evenly to obtain the desired thickness of bond. Typically the thickness of the joint is greater than 5mm.